"WAFER-NOLOGY" the Terminology of Wafers

Si -- Silicon symbol [Si] and atomic number [14]

(Melting Point of [1683 K][1410 °C][2570 °F])

SiN -- Silicon Nitride [Si3N4]

Sputtering -- Wafer Deposition Process

TEOS -- – TetraEthylOrthoSilicate (Si(OC2H5)4)

TEOS is mainly used as a cross-linking agent in silicone polymers and as a precursor to silicon dioxide in the semiconductor industry.

Thermal Oxide -- abbreviation option is TOX

TSV -- Through Silicon Via

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