Comprehensive Equipment Set – Full range of available services for defect characterization, and film thickness measurement Industry Expertise – We specialize in semiconductor wafer applications. All materials are handled in compliance with rigorous cleanroom protocols. Full Service – Free local pickup and delivery available.

Defect Characterization and Analytical Services

• Unpatterned Wafer Defect Detection with KLA-Tencor Surfscan SP-1 and SP-2
  –  200mm and 300mm diameter capability
  –  Particle Measurement on bare silicon and films
  –  Wafer pre-scanning and post-scanning services
  –  Custom recipe development available
  
  
• Scanning Electron Microscopy (SEM)
  –  Hitachi 4800 Field Emission SEM
  –  Applied Materials SEMVision Defect Review System
  –  Zeiss 200mm Tungsten Filament SEM
  
  
• Other High Resolution Imaging
  –  Transmission Electron Microscopy (TEM)
  –  Field Emission Transmission Electron Microscopy (FTEM)
  –  Scanning Transmission Electron Microscopy (STEM)
  –  Focused Ion Beam (FIB)
  –  Neutron Activation (NAA)
  –  Electron Energy Loss Spectroscopy (EELS)
  
  
• Surface Analysis Services
  –  Energy Dispersive X-Ray Spectroscopy (EDX / EDS)
  –  Scanning Auger Microscopy (SAM)
  –  Atomic Force Microscopy (AFM)
  –  Auger Electron Spectroscopy (AES)
  –  Dynamic Secondary Mass Spectroscopy (SIMS)
  –  Quadruple Secondary Mass Spectroscopy (SIMS)
  –  Time-of-Flight Mass Spectroscopy (TOF-SIMS)
  –  Electron Spectroscopy for Chemical Analysis (ESCA or XPS)
  –  X-Ray Diffraction (XRD)
  –  Rutherford Back Scattering (RBS)
  –  X-Ray Reflection (XRR)
  –  X-Ray Diffractions (XRD)
  –  Micro-Raman - Visible & UV
  
  
• Analytical Chemistry Services
  –  Ion Chromatography (IC)
  –  Inductively Coupled Plasma Mass Spectroscopy (ICP-MS)
  –  Vapor Phase Deposition (VPD)
  –  Gas Chromatography Mass Spectrometry (GC-MS)
  –  Titration
  –  Inductively Coupled Plasma Optical Emission (ICP-OES)
  –  Fourier Transform Infrared Spectroscopy (FTIR)
  –  Assay
  
  
• Other Analysis Services Available on Request
  
  

Film Thickness Measurment Services

• Variety of Film Thickness Measurment services available
  –  Rudolph MetaPulse
  –  Ellipsometry
  –  Other methods available on request
  

Wafer Metrology and Inspection Information

Particle Measurement Services using KLA-Tencor Surfscan SP-1 and SP-2
Visit us again soon for more information on unpatterned wafer defect inspection technology!