Comprehensive Equipment Set – Full range of available services for defect characterization, and film thickness measurement Industry Expertise – We specialize in semiconductor wafer applications. All materials are handled in compliance with rigorous cleanroom protocols. Full Service – Free local pickup and delivery available.

Defect Characterization Analysis Services

• Unpatterned Wafer Defect Detection with KLA-Tencor Surfscan SP-1 and SP-2
  –  200mm and 300mm diameter capability
  –  Particle Measurement on bare silicon and films
  –  Wafer pre-scanning and post-scanning services
  –  Custom recipe development available
  
  
• Scanning Electron Microscopy (SEM)
  –  Hitachi 4800 Field Emission SEM
  –  Applied Materials SEMVision Defect Review System
  –  Zeiss 200mm Tungsten Filament SEM
  
  
• Other Particle and Defect Analysis Services
  –  Energy Dispersive X-Ray Spectroscopy (EDX / EDS)
  –  Scanning Auger Microscopy (SAM)
  –  Atomic Force Microscopy (AFM)
  –  Focused Ion Beam (FIB)
  –  Other Analysis Services Available on request
  
  

Film Thickness Measurment Services

• Variety of Film Thickness Measurment services available
  –  Rudolph MetaPulse
  –  Ellipsometry
  –  Other methods available on request
  

Wafer Metrology and Inspection Information

Particle Measurement Services using KLA-Tencor Surfscan SP-1 and SP-2
Visit us again soon for more information on unpatterned wafer defect inspection technology!