"WAFER-NOLOGY" the Terminology of Wafers


P-Type --

Semiconductor material that has positively charged conductivity (a deficiency of electrons).

P-V -- Peak to Valley Measurement. (Regarding Surface Flatness).

One main way (the most common) to measure the measurement of the difference between the actual surface of the optic and the surface it would have if it were defect-free. This is the difference between the "highest" and "lowest" parts on the surface of the optic, those "top" and "bottom" being defined as the local difference between the actual optic and the ideal one. Note: This ignores the curvature of the optics, which is not a defect.

Pb -- Lead symbol [Pb] and atomic number [82]

(Melting Point of [600.6 K][327.6 °C][621.7 °F]) Lead is a soft, malleable poor metal. It is also counted as one of the heavy metals. Metallic lead has a bluish-white color after being freshly cut, but it soon tarnishes to a dull grayish color when exposed to air. Lead has a shiny chrome-silver luster when it is melted into a liquid.

Pd -- Palladium [Pd] and atomic number [46]

(Melting Point of [1825 K][1552 °C][2826 °F]) It is a rare and lustrous silvery-white metal. Palladium, platinum, rhodium, ruthenium, iridium and osmium form a group of elements referred to as the platinum group metals (PGMs). These have similar chemical properties, but palladium has the lowest melting point and is the least dense of them.

PECVD -- Plasma Enhanced Chemical Vapor Deposition. See CVD


Periodic Table -- is a tabular display of the chemical elements, organized on the basis of their atomic numbers and chemical properties.


Periodic Table -- for Alkali and Alkaline metals.


Periodic Table -- for Transition Metals.


Periodic Table -- for Metaloids and Non Metals.


Periodic Table -- for Lanthanides and Actinides.


PR -- PhotoResist.

Photoresistis a light-sensitive material used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a surface.

Photolithography -- process used in Microfabrication...


PPB -- Parts Per Billion.


PPC -- Post Polish Clean.

Post-polish cleaning is an essential step in the wafer manufacturing process. Polishing is performed with a polishing pad and a slurry comprised of very fine silica particles suspended in a liquid and adjusted with a caustic to a desired pH. The balance of the abrasive effect of the particles and the etching effect of the caustic leaves a perfect, defect-free surface.

Pt -- Platinum symbol [Pt] and atomic number [78]

(Melting Point of [2045 K][1772 °C][3222 °F] Platinum has six naturally occurring isotopes. It is one of the rarest elements in the Earth's crust and has an average abundance of approximately 5 μg/kg. It is the least reactive metal. It occurs in some nickel and copper ores along with some native deposits, mostly in South Africa, which accounts for 80% of the world production.

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